Multi-Axis Large-Range Silicon-Micromachined Force Sensing System
Year: 2025
Type: conference-paper
Abstract: This paper reports the first microfabricated modular multi-degree-of-freedom (DOF) force sensing system using a p+ silicon and glass wafer stack. The proposed 2-DOF sensor combines a large measurement range and$\text{small} \ 2\times 2 \ \text{mm}^{2}$active region with the use of common and off-the-shelf substrates. The four mask fabrication method entails dry-etching of electrodes and 300 µm high micro-pillars into bulk silicon, which are anodically bonded to a glass wafer containing micromachined cavities with gold electrodes. Four 2-DOF sensor elements can be assembled in a single package to allow for larger-range 6-DOF force/torque sensing functionality. The sensor was characterized for 0–15 N in normal direction and 0-2.5 N in shear direction, showing relatively high sensitivities for the sensor size due to the dense electrode array.
Authors: Lars Holm, Remco J. Wiegerink, Dennis Alveringh
Institution: University of Twente
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4413322561