Work

Characterizing Capacitor Top Plate Bias for More Accurate Electromagnetic Simulations

Year: 2025

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2025.3600905

Authors: Peter J. Zampardi, Quinn Davenport, Leonard Hayden

Institution: Qorvo (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4413359383

FWCI: 0.326

Cites: 7

Cited by: 2

Related to: 10