Transparent and Fine Film Stencils with Functional Coating for Advanced Surface Mount Technology
Year: 2025
Type: article
Abstract: Technological advancements for the miniaturization of electronic components highlight a critical role of thin and durable stencils in advanced surface mount technology. Here, we report a transparent and fine film stencil consisting of a clear polyimide film and a functional diamond-like carbon coating layer for the fine-pitch surface mount technology process. High-quality and burr-free apertures in the thin film result from the thermally stable laser-cut process using a repetitive and low-power irradiation of nanosecond pulse laser, enhancing the printing accuracy of solder paste with fewer solder joint defects. The carbon coating layer with an electrostatic discharge composition facilitates smooth and robust surfaces and sidewalls of the apertures for the high solder paste release and high mechanical durability of the fine film stencil. The low-cost and easy fabrication of the fine film stencil accelerates the potential industrial replacement of the conventional metal stencils at a reduced thickness and further open a new opportunity for the mass production of the fine-pitch surface mount technology process.
Source: Micromachines
DOI: 10.3390/mi16090969
Authors: Byoung-Hoon Kang, Wonsoon Park, Kyungjun Park, Hunjoong Lee, Junjong Yoo, Namsun Park, Chulyong Jung
Institutions: Samsung (South Korea), Samsung Electronics (South Korea)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,534
OpenAlex ID: W4413426650