Work

Novel low temperature active soldering of Ti-MAO/substrate (Si wafer and sapphire) with In49Sn0.5Lu active solder in air

Year: 2025

Type: article

Source: Materials Science and Technology

DOI: 10.1177/02670836251367118

Authors: Yen-Yu Chen, Lung-Chuan Tsao

Institution: National Pingtung University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Ministry of Science and Technology, Taiwan

Award: Joints Properties of 7075 Aluminum Foams / 7075 Aluminum Plate by Ultrasonic-Assisted Active Transient Liquid Phase Bonding Process

OpenAlex ID: W4413434900

FWCI:

Cites: 49

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Related to: 10