Work

Molecularly Engineered Self‐Healing Polyimide with Dynamic Bond Exchange for Durable and Flexible Electronics

Year: 2025

Type: article

Source: Advanced Materials Technologies

DOI: 10.1002/admt.202500834

Authors: Haeun Shin, Dukkyu Park, Heung Cho Ko, Nam‐Ho You

Institutions: Gwangju Institute of Science and Technology, Korea Institute of Science and Technology

Language: English

Topic: Polymer composites and self-healing

Subfield: Polymers and Plastics

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Gwangju Institute of Science and Technology

OpenAlex ID: W4413435729

FWCI: 1.405

Cites: 52

Cited by: 6

Related to: 10