Work

Rapid Full-Field Surface Topography Measurement of Large-Scale Wafers Using Interferometric Imaging

Year: 2025

Type: article

Abstract: Rapid full-field surface topography measurement for large-scale wafers remains challenging due to limitations in speed, system complexity, and scalability. This work presents a interferometric system based on thin-film interference for high-precision wafer profiling. An optical flat serves as the reference surface, forming a parallel air-gap structure with the wafer under test. A large-aperture collimated beam is introduced via an off-axis parabolic mirror to generate high-contrast interference fringes across the entire field of view. Once the wafer is fully illuminated, topographic information is directly extracted from the fringe pattern. Comparative measurements with a commercial interferometer show relative deviations below 3% in bow and warp, confirming the system’s accuracy and stability. With its simple optical layout, low cost, and robust performance, the proposed method shows strong potential for industrial applications in wafer inspection and online surface monitoring.

Source: Photonics

DOI: 10.3390/photonics12090835

Authors: Ruifang Ye, Jiarui Zeng, Heyan Zhang, Yujie Su, Huihui Li

Institutions: Huaqiao University, Jimei University

Language: English

Topic: Optical measurement and interference techniques

Subfield: Computer Vision and Pattern Recognition

Field: Computer Science

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,896

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China