Work

Dielectric Characterization of Polyimide for UWBG Power Module Packaging at High Temperature

Year: 2025

Type: conference-paper

Source: IEEE Electrical Insulation Conference (EIC)

DOI: 10.1109/eic63069.2025.11123367

Authors: Zannatul Ferdousy Mouri, Md Rafid Kaysar Shagor, Farhina Haque, Sudipto Saha

Institutions: University of Akron, University at Buffalo, State University of New York

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4413442730

FWCI: 2.358

Cites: 33

Cited by: 1

Related to: 10