Work

Transient Thermomechanical Coupling Analysis of Power Device Encapsulation Using an FDTD-Based Explicit Time-Stepping Framework

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3599129

Authors: Yan Peng, Huaguang Bao, Tiancheng Zhang, Dazhi Ding, Jian Yang, Zongguang Yu

Institutions: Nanjing University of Science and Technology, China Electronics Technology Group Corporation

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Jiangsu Province Postdoctoral Science Foundation, National Natural Science Foundation of China, Jiangsu Provincial Key Research and Development Program, Fundamental Research Funds for the Central Universities, Innovation Capability Development Project of Jiangsu Province

Awards: G2185677556, G3171127851, G3192260218, G3750661210, G4082751739, G4221510839, G5228380647, G5367492541, G6028891641, G6363104466, G6809904480, G7821406725

OpenAlex ID: W4413462522

FWCI:

Cites: 23

Cited by:

Related to: 10