A Wideband and Wire-Bonding-Free Packaging Concept for Sub-Terahertz Active Devices
Year: 2025
Type: article
Source: IEEE Electron Device Letters
Authors: Gang Gao, Ziqiao Zhou, Haolin Li, Zhiqiang Li, Weihua Yu
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G3608143877, G4124888560, G6249569603
OpenAlex ID: W4413465754
