Formic Acid-Driven Enhancement of Copper Metal Organic Decomposition Films: Achieving Record-High Conductivity at Low-Processing Temperature
Year: 2025
Type: article
Source: ACS Applied Electronic Materials
Authors: Ting Lin, Ka Ming Ng, Xijun Hu
Institution: Hong Kong University of Science and Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4413533291