Work

Investigation on Warpage Characteristics for Ultralarge MCM FCBGA Package Based on Material-Structure Codesign and Intelligent Optimization

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3602869

Authors: Ping Wu, Zhen Liu, Mingming Yi, Yiou Qiu, Linzheng Fu, Wenhui Zhu, Liancheng Wang

Institution: Central South University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Shantou Science and Technology Project

Awards: G2036657355, G4929624777

OpenAlex ID: W4413677698

FWCI: 0.462

Cites: 34

Cited by: 2

Related to: 10