Work

Development of an Extended-Band mTRL Calibration Kit for On-Wafer Characterization of InP-HEMTs up to 1.1 THz

Year: 2025

Type: article

Abstract: In this work, we present a wideband on-wafer characterization technique for InAlAs/InGaAs/InAs InP-based high-electron mobility transistors (HEMTs) using an optimized multiline Thru-Reflect-Line (mTRL) calibration kit. Our goal is to directly extract transition frequency fT and maximum frequency of oscillation fmax values from S-parameters measurements with frequencies up to 1.1 THz and overcome the limitations of the traditional 20 dB/dec extrapolation method using lower-frequency band measurements. Indeed, as the state-of-the-art transistors now exhibit cutoff frequencies exceeding 1 THz, standard low-frequency extrapolation methods become increasingly inaccurate. Full-wave electromagnetic simulations were used to design low-loss coplanar waveguide (CPW) access structures with stable impedance and minimal parasitic effects. These structures were co-fabricated with HEMTs and calibration standards on the same InP substrate. The 2-finger transistor with a 80 nm gate length exhibits a directly measured fT = 320 GHz and fmax = 800 GHz. The technique showed high consistency across six frequency bands and confirms that direct broadband measurement with mTRL improves accuracy. This work highlights the metrological strength of mTRL-based setups for next-generation THz device characterization.

Source: Electronics

DOI: 10.3390/electronics14173472