CIGS tandem on Silicon: an approach to stick around
Year: 2025
Type: conference-paper
Authors: T. Bidaud, F. Pineau, E. Salmon, J. Buencuerpo, R. Pusapat, B. Vermang, J. De Wild, P. Spreer, H.-P. Sperlich, N. Barreau, N. Naghavi, J. F. Guillemoles, S. Collin
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4413822283
