Enhancement of Transmitting Sensitivity for Piezoelectric Micromachined Ultrasonic Transducers via Back-Cavity Package Design
Year: 2025
Type: article
Source: IEEE Electron Device Letters
Authors: Xiangyang Wang, Chongbin Liu, Jian Zhang, Sheng Liu, Guoqiang Wu
Institution: Wuhan University
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G3173688712, G5614451526
OpenAlex ID: W4413822423
