Work

New technical platform on chip packaging dedicated to practical training in microelectronics

Year: 2025

Type: conference-paper

Source: Annual Conference of the European Association for Education in Electrical and Information Engineering (EAEEIE)

DOI: 10.1109/eaeeie65428.2025.11136376

Authors: Mohammed Irar., Olivier Bonnaud, Ahmad Bsiesy

Institutions: Institut polytechnique de Grenoble, Centre Interuniversitaire de MicroElectronique et Nanotechnologies

Language: English

Topic: Engineering Education and Pedagogy

Subfield: Architecture

Field: Engineering

Domain: Physical Sciences

SDG: Quality education

Open Access status: closed

Funder: Agence Nationale de la Recherche

Award: Ingénierie de Formations Innovantes et Stratégiques en Microélectronique

OpenAlex ID: W4413822724

FWCI: 8.673

Cites: 11

Cited by: 1

Related to: 10