Work

Thermodynamic Analysis of TCV Interconnect Structure With Recast Layers and Rough Interfaces for High-Power Device Packaging

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3605618

Authors: Xin Zou, Zhirui Xu, Hao Chen, Yang Peng, Qing Wang, Mingxiang Chen

Institution: Huazhong University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, China Postdoctoral Science Foundation

Awards: G7446289976, G7825487459, G8114649372

OpenAlex ID: W4413967071

FWCI: 0.453

Cites: 40

Cited by: 2

Related to: 10