Work

Analysis of Interface Evolution and Failure Mechanism of Sn 3.5 Ag Microcopper Pillar Solder Joints Under High Current Density

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3605741

Authors: Changping Chen, Mengtao Xiao, Xiaokang Liu, Qiang Zhang, Jiameng Zhang, Xinjian Li, Junhui Li

Institutions: Central South University, Guangxi University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science and Technology Major Project, Key Research and Development Program of Hunan Province of China, Key Research and Development Program of Sichuan Province, Changsha Science and Technology Project

Awards: G3367674884, G4356689988, G4818314863, G564941010

OpenAlex ID: W4413967089

FWCI: 0.231

Cites: 14

Cited by: 1

Related to: 10