Work

Research on Repair Method of Solder Pad Based on Electronic Additive Manufacturing Technology

Year: 2025

Type: conference-paper

DOI: 10.1109/icaidt66272.2025.00067

Authors: Muchen Xian, Zhiyuan Ma, Jinzhe Wu

Institution: Naval University of Engineering

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414054382

FWCI:

Cites: 2

Cited by:

Related to: 10