Work

Leveraging Tensor Dataflow for Improved Thermal Performance on 3D-Stacked SRAM Architecture

Year: 2025

Type: article

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

DOI: 10.1109/tcad.2025.3607137

Authors: Pengyu Liu, Liyan Chen, Zelong Yuan, Yingkun Liu, Jianfei Jiang, Qin Wang, Zhigang Mao, Naifeng Jing

Institution: Shanghai Jiao Tong University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G485017845, G6951235267

OpenAlex ID: W4414080385

FWCI: 0.231

Cites: 41

Cited by: 1

Related to: 10