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A Gradient Boosting Machine Learning for Predicting Seam Width and Tensile Strength in Pulsed Laser Bonding of Glass to Copper

Year: 2025

Type: conference-paper

Source: International Conference on Applying New Technology in Green Buildings (ATiGB)

DOI: 10.1109/atigb66719.2025.11142114

Authors: Hoai Nguyen, Le Chau Thanh Nguyen, Tan Thong Ngo, Nguyen Hiep Le

Institutions: University of Da Nang, Trường Đại học Sư phạm Kỹ thuật

Language: English

Topic: Welding Techniques and Residual Stresses

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4414169671

FWCI:

Cites: 9

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