Dynamic Temperature Simulated Annealing Algorithm for the PCB Assembly Process
Year: 2025
Type: conference-paper
Authors: Lilong Yang, Guangyu Lu, Yuhang Bi, Zhitai Liu
Institution: Harbin Institute of Technology
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G1462590293
OpenAlex ID: W4414169846
