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A PCB SMD Solder Quality Inspection Method Based on Dual-Path Region Segmentation and Color Clustering

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Year: 2025
Type: conference-paper
Source: Conference on Fully Actuated System Theory and Applications (FASTA)
DOI: 10.1109/fasta65681.2025.11138582
Authors: Yang Cheng, JinYong Yu, WeiHua Liu
Institutions: Harbin Institute of Technology, Yongjiang Laboratory
Language: English

Topic: Industrial Vision Systems and Defect Detection
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Zhejiang Province
Awards: 面向混合键合对准工艺中的超高精度晶圆视觉检测方法研究, G6108543026
OpenAlex ID: W4414169937
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Cites: 14
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