A PCB SMD Solder Quality Inspection Method Based on Dual-Path Region Segmentation and Color Clustering
Year: 2025
Type: conference-paper
Authors: Yang Cheng, JinYong Yu, WeiHua Liu
Institutions: Harbin Institute of Technology, Yongjiang Laboratory
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4414169937
