Work

An Online Junction Temperature Estimation Method of Press-Pack IGBTs Based on Thermal Network Model With Multiple Heat Flow Paths

Year: 2025

Type: article

Source: IEEE Journal of Emerging and Selected Topics in Power Electronics

DOI: 10.1109/jestpe.2025.3609961

Authors: Liuyu Tu, Lin Liang, Ziyang Zhang

Institutions: State Key Laboratory of Advanced Electromagnetic Engineering and Technology, Huazhong University of Science and Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: National Key Research and Development Program of China

Awards: G7142121383, G8851353701

OpenAlex ID: W4414197223

FWCI:

Cites: 33

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