Work

Near-Memory LLM Inference Processor based on 3D DRAM-to-logic Hybrid Bonding

Year: 2025

Type: conference-paper

Source: Proceedings - ACM IEEE Design Automation Conference

DOI: 10.1109/dac63849.2025.11132870

Authors: Sanghyeok Han, Byungkuk Yoon, Gyeonghwan Park, Choungki Song, Dongkyun Kim, Jae-Joon Kim

Institutions: Seoul National University, SK Group (United States), SK Group (Japan), SK Hynix (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: SK Hynix, Seoul National University, IC Design Education Center

OpenAlex ID: W4414198165

FWCI: 9.434

Cites: 16

Cited by: 4

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