Work

Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3610036

Authors: Fuhan Liu, Rui Zhang, Kanno Kimiyuki, Joon Woo Kim, Madhavan Swaminathan, Rao R. Tummala

Institutions: Georgia Institute of Technology, JSR (Japan), Pennsylvania State University

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Georgia Tech 3D Systems Packaging Research Center

OpenAlex ID: W4414199168

FWCI:

Cites: 12

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