Work

Uncertainty Analysis of the Interface Thermal Resistance Between Power Module and Heatsink

Year: 2025

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2025.3610704

Authors: Ziheng Wang, Yi Zhang, Huai Wang

Institutions: Aalborg University, Hong Kong Polytechnic University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414229580

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