Work

Laser-Enhanced Direct Print Additive Manufacturing (LE-DPAM) for Low-Loss, Low-Parasitic Heterogeneous Integration of MMICs

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3610268

Authors: Ruoke Liu, Di Lan, Ramiro A. Ramirez, Benjamin Reams, Liguan Li, Thomas Weller, Jing Wang

Institution: University of South Florida

Language: English

Topic: Microwave Engineering and Waveguides

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Science Foundation, Army Research Laboratory

Awards: GOALI: Mm-Wave Reconfigurable Additive Manufactured Packaging Systems (RAMPS) using Pulsed Picosecond Laser Processing, Collaborative Research: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS), G8138275184

OpenAlex ID: W4414230089

FWCI:

Cites: 38

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