Work

Enhanced Microhardness of Mild Steel due to Electrodeposition of Copper Controlled by Temperature and pH

Year: 2025

Type: conference-paper

Source: International Conference on Business and Industrial Research (ICBIR)

DOI: 10.1109/icbir65229.2025.11163257

Authors: Md. Hasan Al Nafis, Tanvir Ahmed, Md. Ehasanul Haque, Shihab Mehedi Shuvo, Maksuraton Nishat, Md. Sarowar Hossain

Institution: American International University-Bangladesh

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4414231980

FWCI:

Cites: 9

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