Work

Impact pin-pull test and simulation on the micro-pads of package substrates

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3082084

Authors: Dongcheng Gao, Jingran Zhang, Qiqin Wei, Guolin Lin, Jianshu Lu, Miao Cai

Institution: Guilin University of Electronic Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414323678

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