Trends in Semiconductor Packaging Technologies and Development Strategies by Application Field
Year: 2025
Type: article
Authors: 인하공업전문대학 재료공학과 교수, Kyoung-Bo Kim, Jongpil Lee, Moojin Kim
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4414394815
FWCI:
Cites:
Cited by:
Related to: