Fabrication of Multilayer Ceramic Substrates via Low-Temperature Cu–Cu Bonding Using Gold Passivation Layer
Year: 2025
Type: article
Source: IEEE Electron Device Letters
Authors: Hao Chen, Zhenyu Lei, Xin Zou, Zhirui Xu, Yang Peng, Qing Wang, Mingxiang Chen
Institution: Huazhong University of Science and Technology
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G7446289976, G8418007283
OpenAlex ID: W4414431968