Work

Experimental Study on Diffusion Bonding of OFHC Cu for Vacuum Tube Applications

Year: 2025

Type: conference-paper

Source: IEEE Wireless Antenna and Microwave Symposium (WAMS)

DOI: 10.1109/wams64402.2025.11158445

Authors: Santosh Kumar, H S Karthik, K Santhosh Kumar, N Venkaiah, M V Karthikeyen, S K Datta

Institutions: Microwave Tube Research & Development Centre, Indian Institute of Technology Tirupati, Indian Institute of Information Technology, Design and Manufacturing, Kancheepuram

Language: English

Topic: Advanced Welding Techniques Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414432200

FWCI:

Cites: 12

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