Work

The Mechanical Properties and Microstructural Evolution of Copper Pillar in Through Glass Vias under Different Temperatures

Year: 2025

Type: article

Source: ACS Applied Electronic Materials

DOI: 10.1021/acsaelm.5c01336

Authors: Miao Wang, Jihua Zhang, Libin Gao, Hongwei Chen, Wenbo Luo, Wenlei Li, Xiaoshen Han, Dongbin Wang, Shuang Li, Ting Liu, Xingzhou Cai, Yong Li, Bin Peng, Wanli Zhang

Institution: University of Electronic Science and Technology of China

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Science, Technology and Innovation Commission of Shenzhen Municipality

Award: G1338558852

OpenAlex ID: W4414434681

FWCI: 1.126

Cites: 61

Cited by: 5

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