Year: 2025
Type: article
Abstract: To promote independent technological advancement in chips and break through the technical blockade faced by China's sensor industry, this work has developed a novel process. This process utilizes the solid porous 3D microstructure of Broussonetia papyrifera to achieve microscale thermal isolation, while proposing the use of thin-film layered structures of Broussonetia papyrifera to optimize and improve existing thermal MEMS devices. Breakthroughs in process preparation technology enable the production of precision MEMS sensors. Currently, this product achieves a micron-level process grade and supports wafer fabrication in both 8-inch and 10-inch sizes. Under the same 10-inch standard scale, the unit batch yield reaches 98.76%, with up to 576 sensor chips per single wafer, representing industry-leading performance. Due to these characteristics, the product has been widely applied in smart vehicles, intelligent healthcare, electronic resonance sensors, and other fields.
DOI: 10.54691/7yd8n579
Authors: Xiaohan Yin, Kang Shuai, Chunxiu Su
Institution: Changzhou University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4414445528