Work

Physics-Enhanced BGA-RDL Interconnects Model for Millimeter-Wave 3-D Packaging

Year: 2025

Type: article

Source: IEEE Transactions on Microwave Theory and Techniques

DOI: 10.1109/tmtt.2025.3611964

Authors: Yiwen Liu, Huanpeng Wang, Jie Liu, Yunqiu Wu, Huihua Liu, Yiming Yu, Chenxi Zhao, Qingfeng Zhang, Kai Kang

Institutions: University of Electronic Science and Technology of China, China Electronics Technology Group Corporation

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Sichuan Province

Awards: G4167916329, G6682819074

OpenAlex ID: W4414459115

FWCI: 1.144

Cites: 25

Cited by: 5

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