Radiation Source Reconstruction for TSV-Based Chips and Multilayer Circuits via Optimized Neural Networks
Year: 2025
Type: article
Authors: Hao Cheng, Weimin Wang, Yongle Wu, Keyan Li, Yuanan Liu
Institution: Beijing University of Posts and Telecommunications
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4414459133