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Packaging Technologies for Power Devices Utilized in EV/HEV Applications: The State-of-the-Art

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3613928

Authors: Yun-Hui Mei, Yongqi Pei, Lu Wang, Puqi Ning, Gaojia Zhu

Institutions: Tiangong University, Chinese Academy of Sciences, Institute of Electrical Engineering

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

Funders: National Natural Science Foundation of China, Tianjin Municipal Science and Technology Bureau, Chinese Academy of Sciences Key Project

Awards: G1573602605, G171544136, G6956979255, G8059616785

OpenAlex ID: W4414463136

FWCI: 0.907

Cites: 94

Cited by: 4

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