Work

Frequency-Domain Modeling of Interconnects Based on Assemble Neural Network for 3-D Integration

Year: 2025

Type: article

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

DOI: 10.1109/tcad.2025.3614103

Authors: Zi-Xing Ye, Da-Wei Wang, Wen-Sheng Zhao, Xuan Lin, Nengyong Zhu, Min Tang, Jun Liu, Lingling Sun

Institutions: Hangzhou Dianzi University, Shanghai Jiao Tong University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Fundamental Research Funds for the Central Universities

Awards: G1548837212, G2590409249, G3975477152, G5487849074

OpenAlex ID: W4414463405

FWCI: 0.453

Cites: 51

Cited by: 2

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