Work

Research on Automated Microassembly Technology for ICF Target Core Microdevices Based on Teleoperation

Year: 2025

Type: article

Source: IEEE Robotics and Automation Letters

DOI: 10.1109/lra.2025.3614545

Authors: Hongwei Deng, Kejian Ni, Xiepeng Yang, Haoran Dai, Tao Chen

Institution: Soochow University

Language: English

Topic: Teleoperation and Haptic Systems

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G2854468125

OpenAlex ID: W4414499230

FWCI:

Cites: 28

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