Work

Board-Level Reliability of 100 × 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3614186

Authors: Yongwon Lee, Kaushik Godbole, Hyunggyu Park, Kyoung-Sik Moon, Muhannad Bakir, Suresh K. Sitaraman

Institution: Georgia Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4414499424

FWCI: 0.924

Cites: 33

Cited by: 4

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