Work

Benchmarking Machine Learning Methods Against Finite Element and Empirical Models for Predicting Solder Joint Characteristic Life

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3614513

Authors: Soroosh Alavi, Omma Sumaiya, Daniel F. Silva, Jia Liu, Sa'd Hamasha

Institutions: Auburn University, University of Florida, Binghamton University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, U.S. Department of Defense

OpenAlex ID: W4414499454

FWCI: 0.46

Cites: 39

Cited by: 2

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