Work

Reinforcement Learning-Based via Placement Optimization in Package Substrate for Multiple Power Domain 3D-ICs

Year: 2025

Type: conference-paper

DOI: 10.1109/emcsipi52291.2025.11170244

Authors: Seunghun Ryu, Seonghi Lee, Dongryul Park, Sanguk Lee, Hyunwoo Kim, Dongkyun Kim, Jinwook Lee, Seokbeom Yong, Sangsub Song, Seungyoung Ahn

Institutions: Korea Advanced Institute of Science and Technology, Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414499860

FWCI: 6.824

Cites: 10

Cited by: 3

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