Work

Thermal Electromagnetic Co-Design of a MultiChip Radio Frequency Front-End System-in-Package With Embedded Microchannel Cooling

Year: 2025

Type: article

Source: Journal of Thermal Science and Engineering Applications

DOI: 10.1115/1.4069967

Authors: Pan Ren, Cong Liu, Yaya Liang, Bo Peng, Pingan Du

Institutions: University of Electronic Science and Technology of China, China Electronics Technology Group Corporation

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G8603420406

OpenAlex ID: W4414501632

FWCI: 0.462

Cites: 32

Cited by: 2

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