Deformation and Pulse Current Coinduced Microstructural Evolution at Al–Cu Interfaces: Mechanisms and Temperature Effects
Year: 2026
Type: article
Abstract: This work system reveals the critical control mechanism of joining temperature (425–500 ℃) on the interfacial microstructure and mechanical properties of Al/Cu bimetallic composites. Results indicate that temperature dominates interfacial evolution through a competitive mechanism involving recrystallization, diffusion, and compound growth: temperature exerts a nonlinear regulatory effect on the pulse current diffusion joining process, significantly controlling the microstructural evolution of the Cu layer via dynamic recrystallization. Below the critical threshold of 450 °C, recrystallization in the Cu layer substantially increases, while the high-stacking-fault Al layer undergoes predominantly dynamic recovery. Beyond 475 °C, accelerated interfacial reactions cause IMC coarsening and thermal stress crack initiation, leading to brittle interfacial failure. Theoretical analysis reveals a synergistic effect between Joule heating and the electron wind from pulse current, promoting preferred growth along close-packed planes and releasing residual stresses. This facilitates an optimized interface structure with low dislocation density and high orientation stability, offering a novel approach for connecting heterogeneous materials in aerospace lightweighting and electronic packaging.
Source: Advanced Engineering Materials
DOI: 10.1002/adem.71148
Authors: Zhen Wen, Mengting Ran, Wenxian Wang, Yalong Zhao, Yutong Zhao
Institutions: Taiyuan University of Technology, Central South University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
Awards: G3838701667, G5281598909
OpenAlex ID: W4414527850