Year: 2025
Type: article
Abstract: ABSTRACT This paper presents a newly developed process for interconnecting microICs with microLEDs through ultra‐precise dispensing of conductive silver‐based paste. Special cleaning and surface energy modification processes have been introduced to achieve interconnects with a width of 5 μm and a minimum pitch of 20 μm. The developed technology is part of the EU funded project “Building Active matrix MicroLED displays By Additive Manufacturing” (BAMBAM), which develops unique manufacturing technologies for realizing microLED displays without TFT backplanes.
DOI: 10.1002/jsid.2109
Institution: University of Stuttgart
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $3,400
OpenAlex ID: W4414586944