Method for Automated Calculation of Grains and Voids in Metal Films and Tsv-structures
Year: 2025
Type: article
Source: Russian Microelectronics
Author: N.A. Dyuzhev
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4414690420
FWCI:
Cites:
Cited by:
Related to: