Work

Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3617495

Authors: Yeonju Kim, Kyungmin Shin, Donghyeok Choi, Jongshin Hyun, Byungjoo Jin, Jong Kyung Park

Institution: Seoul National University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Research Foundation of Korea, Ministry of SMEs and Startups

Awards: G3089632297, G4237034042

OpenAlex ID: W4414798866

FWCI: 0.462

Cites: 34

Cited by: 2

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