The thermal cycling response of Sn-Zn, Sn-Ag-Cu and Sn-Bi solder in industrial production
Year: 2025
Type: article
Abstract: The reliability of different solder joints assembled with Sn-Zn, Sn-Ag-Cu, and Sn-Bi solders under thermal cycling conditions based on industrial production conditions was analyzed in this study. The results of dye and pull test indicated that there were significant differences in the number, types, and location of fractures at different component joints soldered with different solder. Due to the excellent mechanical properties and unique intermetallic compound (IMC) composition, the number of fractures in Sn-Zn solder joints is remarkably lower than the Sn-Ag-Cu and Sn-Bi solder, indicating that the Sn-Zn system is more reliable under thermal cycling. These findings demonstrated that Sn-Zn solder is more suitable for industrial production of the complex printed circuit boards (PCBs) and has a better durability.
Source: Microelectronics Reliability
Authors: Tianyuan Chen, Mengran Zhou, Hao Fu, Xiaohua Xu, Xinhua Dong, Yunjian Zhao, Gaoqiang Chen, Gong Zhang, Qingyu Shi
Institution: Tsinghua University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $2,280
Awards: G4399905675, G6623328637
OpenAlex ID: W4414802660