Work

A Study of Multi-Chip Carrier Structure for SiC PCB-Embedded Power Module

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11183940

Authors: Jia-Jun Lai, Xuelun Zhang, Hao Sun, Ye Zhu, Yunbin Pan, Mingfu Li, Ziliang Shi, Xiong Yang, Xunjin Xu, Min Chen

Institution: Zhejiang University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414898307

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Cites: 5

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