Work

Oxidation-Free Sintered Copper Die Attachment for Power Electronics Packaging

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11183904

Authors: Junyang Chen, Haiqiang Zhao, Zewei Zhang, Zhuo Pang, Tsung-Huan Sheng, Yi Chiu, Zhi-Ying Huang, Yen-Liang Lin, Meiyu Wang

Institution: Nankai University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4414898382

FWCI:

Cites: 9

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